Qualcomm today announced Quick Charge 4+, an update to the Quick Charge 4 spec that targets efficiency and heat management. Quick Charge 4+ has specific changes when compared to Quick Charge 4. First, Qualcomm updated the Dual Charge feature, which now includes two power management integrated circuits. This means devices charging via Dual Charge will see a divided charge current, lower thermal dissipation, and quicker charge times. Second, Quick Charge 4+ includes intelligent thermal balancing, which Qualcomm says automatically moves the current via the coolest path to eliminate hot spots. Lastly, Quick Charge 4+ can monitor both the phone casing and connector temperatures at the same time, which can further help prevent overheating and/or short-circuit failure in the Type-C connector. Since Quick Charge 4+ builds on the foundation set by Quick Charge 4, device makers will need to include all three of these new functions to gain the Quick Charge 4+ designation for marketing purposes. In the end, Qualcomm says Quick Charge 4+ delivers 3*C cooler charging temperatures, 15% quicker charging times, and an average of 30% more efficiency. It will be up to individual device makers to adopt Quick Charge 4+ in their hardware.
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